The Machine operates on suction principle of abrasive blasting. It incorporates highly engineered indexing turntable.

Synchronization of gun reciprocation and job rotation is through PLC. This Hi-tech synchronization produce a uniform non reflective finish and clean surface of silicon wafers.





The surface finishing of critical component used in solar cell i.e. silicon wafer (Dia. 100-300 mm) is a very specialized task. Surface preparation of silicon wafer before etching and silver pasting is done to get better yield (wattage) from solar cell.